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| VPX specifications establish a new direction for the next revolution in bus boards. VPX is a proposed ANSI standard which breaks out from the traditional connector scheme of VMEbus to merge the latest in connector and packaging technology with the latest in bus and serial fabric technology.
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Freescale Processors on 3U VPX Boards
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Freescale
MPC8640D
Dual e600 core,
Integrated AltiVec
64-bit FPU
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L,V,Q,G /
1,2,3,4,5
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One PrPMC/XMC site
- x4 PCI Express Fat Pipe P1.A
- Serial RapidIO Fat Pipe P1.A
- x4 PCI Express P1.B
- Two SERDES Thin Pipe P1
- Two GigE ports
- Two serial ports
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More about XPedite5170
- Rugged Design (REDI)
- Conduction or air cooling
- 4GB DDR2-533 ECC SDRAM
- 256 MB of NOR flash
- 4 GB of NAND flash
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Freescale
MPC8572E
PowerQUICC™ III,
e500 core
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L,V,Q,G /
1,2,3,4,5
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One PrPMC/XMC site
- Serial RapidIO to P1.A
- x4 PCI Express to P1.B
- Two SERDES GigE to P1
- I²C port
- Two serial ports
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More about XPedite5370
- Rugged Design (REDI)
- Conduction or air cooling
- 4GB DDR2-800 ECC SDRAM
- 256 MB of NOR flash
- 4 GB of NAND flash
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Intel Processors on 3U VPX Boards
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Intel® Core™i7
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W,L,V,Q,G /
1,2,3,4,5
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One PrPMC/XMC site
- Two PCI Express Fat Pipe
- Two DVI graphic ports
- Two SATA 3.0Gb/s ports
- Two USB ports
- Two GigE ports
- Two serial ports
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More about XPedite7370
- Rugged Design (REDI, VITA 48)
- Conduction or air cooling
- 8GB DDR3-1066 ECC SDRAM
- 8 MB of NOR boot flash
- 16 GB of NAND flash
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Intel®
Core™2Duo
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W,L,V,Q,G /
1,2,3,4,5
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One XMC site
- Two x4 PCI Express
- Two rear-panel GigE
- Two rear-panel USB 2.0
- Six rear-panel SATA
- Two serial ports
- Front I/O
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More about XPedite7172
- Rugged Design (REDI)
- Conduction or air cooling
- 4 GB DDR2-400 ECC SDRAM
- 2 MB firmware hub flash
- 4 GB NAND flash
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Intel®
Core™2Duo
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W,L,V,Q,G /
1,2,3,4,5
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One PrPMC/XMC site
- Two x4 PCI Express
- Two rear-panel GigE
- Two rear-panel USB 2.0
- Two rear-panel SATA
- Two serial ports
- Front I/O
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More about XPedite7170
- Rugged Design (REDI)
- Conduction or air cooling
- 4 GB DDR2-400 ECC SDRAM
- 4 MB firmware hub flash
- 4 GB NAND flash
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MIL-STD-704 28V Input Power Supply for 3U VPX
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Air- and Conduction-Cooled Development Systems
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1,2,3,4,5
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More about XPand3200
- ½ ATR compliant, conduction-cooled system
- 3U VPX and cPCI backplanes available
- Optional front-panel USB port
- Optional SATA SSD memory module
- Optional PCI Express fabric backplane
- Optional Gigabit Ethernet switched backplane
- Configurable standard I/O includes Gigabit Ethernet, USB, RS-232/RS-422, MIL-STD-1553, ARINC-429, SATA, DVI, etc.
- Integration services with third-party modules available
- MIL-STD-704 28V DC input voltage support
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1,2,3,4,5
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More about XPand1300
- Desktop development system for air-cooled modules
- Supports up to fifteen 0.8" or twelve 1.0" pitch slots
- Standard VPX and cPCI configurations
- OpenVPX compliant
- Removable side covers for debug access
- Up to 20 CFM per slot
- RTM (Rear Transition Module) support for maximum I/O flexibility
- Up to 550W of total simultaneous power
- 12V, 5V, 3.3V, +/-12V_AUX and 3.3V_AUX
- 100-240 VAC, 50/60 Hz power input
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1,2,3,4,5
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More about XPand1200
- Development platform for conduction-cooled modules
- Supports 1.0" or 0.8" pitch VPX modules
- OpenVPX standards based
- RTM (Rear Transition Module) support for maximum I/O flexibility
- Up to 550W of total simultaneous power
- Up to 60W per slot at 30˚C ambient and 70˚C rail
- 12V up to 50A
- 5V up to 50A
- 3.3V up to 25A
- +/-12V_AUX and 3.3V_AUX
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1,2,3,4,5
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More about XPm1000
- Two conduction-cooled 3U VPX slots
- Integrated heatsink fins
- Built-in cooling fans
- Reset switch
- J1 fabric A and B routed between slots
- J1 and J2 I/O RJ45 Gigabit Ethernet connectors
- J2 I/O micro DB-9 serial connectors
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More Information
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Related Products
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