Operating Systems & Ruggedization Levels

	Operating System Support
L V W Q G O Y	Linux is supported as an LSP Wind River Systems VxWorks is supported as a BSP Windows 2000/XP is supported, QNX is supported as a BSP, Green Hills INTEGRITY is supported as a BSP. OSE is supported as a BSP. LynxOS is supported as a BSP.

Ruggedization Levels

Five levels of ruggedization are available for X-ES products supporting commercial, extended temperature, and conduction-cooled applications. Products may be air-cooled or conduction-cooled depending on their end application. Optional features such as conformal coatings are available. Contact Electronic Tools for more information about available options for a specific product.

Ruggedization	Level 1	Level 2	Level 3	Level 4	Level 5
Cooling	Standard Air	Extended Air	Rugged Air	Conduction	Conduction
Operating Temperature	0 to + 55 °C	0 to + 65 °C	-40 to + 70 °C	-40 to + 70 °C	-40 to + 85 °C
Storage Temperature	40 to + 105 °C	40 to + 105 °C	40 to + 105 °C	40 to + 105 °C	40 to + 105 °C
Vibration	0.002 g²/Hz	0.002 g²/Hz	0.04 g²/Hz	0.1 g²/Hz	0.1 g²/Hz
Shock	20 g	20 g	40 g	40 g	40 g
Humidity	0% to 95%	0% to 95%	0% to 95%	0% to 95%	0% to 95%
	For standard commercial applications like CompactPCI, ATCA, and AMC	For applications requiring an extended thermal range over Level 1	For applications requiring an extended thermal range as well as increased shock and vibration requirements	For standard industrial and military applications such as VPX or VME	For applications requiring an extended thermal range over Level 4

	Temperature Range and Cooling Options
C I CC	Comercial (0°C to +55°C) Convection Cooled (200 linear feet/min) Industrial (-40°C to +85°C) Convection Cooled (200 linear feet/min) Conduction Cooled (-40°C to +85°C at card edge)