XPedite7040: AMC Module with Intel® Core™2 Duo

XPedite7040
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Information
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Description
- Block Diagram
- Technical Specifications

Downloads
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Datasheet PDF

Intel® Core™ Duo or Intel® Core™2 Duo Processor-Based AMC Module with Gigabit Ethernet, USB, and SATA Support (for ATCA and µTCA Systems)

 


Features

Intel® Core™ Duo or Intel® Core™2 Duo processor
Intel 3100 chipset
Front-panel Gigabit Ethernet
Front-panel RS-232 serial
Front-panel USB 2.0
Complies with AMC.0 and MicroTCA.0 (µTCA)
AMC.1 x4 PCI Express Fat Pipe interface
AMC.2 dual Gigabit Ethernet 1000Base-BX interfaces
AMC.3 Dual SATA interfaces
Two PC3200 SO-RDIMMs, up to 8 GB
Up to 4 GB of NAND flash
Up to 4 MB of Firmware Hub (FWH) storage
AMI BIOS
Windows XP / Vista support
Linux LSP
VxWorks BSP
QNX BSP

Description

The XPedite7040 is a single-width, mid-size or full-size Advanced Mezzanine Card (AMC) single-board computer designed to provide maximum performance and I/O options while minimizing power consumption. The Ultra Low Voltage (ULV) Intel® Core™ Duo processor or Low Voltage (LV) Intel® Core™2 Duo processor provides the XPedite7040 with a significant performance-per-watt processing advantage. Additionally, the Intel 3100 chipset combines the functionalities of an integrated server-class memory controller (Northbridge) and an I/O controller (Southbridge) into a single device that is specifically intended for power- and board-space-sensitive embedded applications.
The XPedite7040 can be installed in an AdvancedTCA (ATCA) AMC.0-compliant carrier or a MicroTCA.0 (µTCA)-compliant backplane. The XPedite7040 supports an AMC.1 x4 PCI Express Fat Pipe interface, dual AMC.2 Gigabit Ethernet 1000Base-BX interfaces, and dual AMC.3 SATA interfaces. Additional serial and general-purpose I/O is provided through the backplane connector.
The XPedite7040 supports two PC3200 SO-RDIMM modules and up to 4 GB of NAND flash for ample on-card memory capacity. 4 MB of Firmware Hub (FWH) space is also supported for redundant BIOS or OS kernel storage.

Block Diagram

 


Processor

Intel Core Duo or Intel Core 2 Duo processor
32 KB L1 instruction/data caches
2 / 4 MB L2 cache
533-MHz or 667-MHz FSB

Memory & I/O Controller Hub

Intel 3100
DDR2-400 ECC SDRAM
Up to 4 GB of NAND flash
4 MB of Firmware Hub (FWH) storage

AMC Backplane Interconnect

Complies with AMC.0 and MicroTCA.0 (µTCA)
AMC.1 x4 PCI Express Fat Pipe interface
AMC.2 dual Gigabit Ethernet 1000Base-BX interfaces
AMC.3 dual SATA interfaces
Dual USB 2.0 interfaces
RS-232/RS-422 serial interface

Front Panel I/O

Micro DB-9 RS-232 serial port
USB 2.0 port
10/100/1000Base-T Gigabit Ethernet port

Software Support

AMI BIOS
Windows XP / Vista support
Linux LSP
QNX BSP
VxWorks BSP

Physical Characteristics

Single-width, mid-size or full-size AMC
Dimensions: 180 mm x 75 mm

Environmental Requirements

Single-width, mid-size or full-size AMC
Dimensions: 180 mm x 75 mm

Power Requirements

Less than 30 Watts