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| Intel® Core™i7 Processor-Based XMC Module
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Description
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| The XPedite7301 is a high-performance, low-power XMC module based on the Intel® Core™i7 processor and Intel QM57 chipset. With up to three PCI Express ports and a Gigabit Ethernet port, the XPedite7301 is ideal for high-bandwidth data-processing applications.
The XPedite7301 accommodates up to 8 GB of DDR3 ECC SDRAM to support memory-intensive applications and hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, and RS-232/RS-422/RS-485.
Wind River VxWorks, QNX Neutrino, Linux, and Green Hills INTEGRITY Board Support Packages (BSPs) are available for the XPedite7301, as well as Windows drivers.
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Features
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Intel® Core™i7-610E, -620LE, and -620UE processors
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Dual-core with hyper-threading technology
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XMC module
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Conduction or air cooling
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Up to 8 GB of DDR3-1066 ECC SDRAM in two channels
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8 MB NOR boot flash
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Up to 16 GB of NAND flash
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Two x4 or one x8 PCI Express P15 XMC interface
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One x4 PCI Express P16 XMC interface
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Gigabit Ethernet port with integrated magnetics
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Four USB 2.0 high-speed ports
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Two SATA 3.0 Gb/s ports
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Two RS-232/RS-422/RS-485 serial ports
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DVI-D video
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Audio line in/out port
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Linux BSP
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Wind River VxWorks BSP
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QNX Neutrino BSP
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Green Hills INTEGRITY BSP
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Microsoft Windows XP/Vista drivers
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Block Diagram
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Processor
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Intel® Core™i7 processor operating at 2.53, 2.0, or 1.06 GHz
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Dual-core with hyper-threading technology
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Intel QM57 chipset
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Dual channel integrated memory controller
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Integrated graphics controller
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4 MB of shared cache
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Memory
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Up to 8 GB of DDR3-1066 ECC SDRAM on two channels
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8 MB NOR boot flash
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Up to 16 GB of NAND flash
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P14 PMC Interface
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Two USB 2.0 ports
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Two RS-232/RS-422/RS-485 ports
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One 10/100/1000BASE-T Ethernet port
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Four GPIO Signals
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One audio in/out port
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P15 XMC Interface
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One x8 or two x4 PCI Express links
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P16 XMC Interface
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One DVI-D display
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Two USB 2.0 ports
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Two SATA 3.0 Gb/s ports
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One x4 PCI Express link
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Software Support
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Linux LSP
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Wind River VxWorks BSP
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QNX Neutrino BSP
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Green Hills INTEGRITY BSP
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Windows drivers
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Physical Characteristics
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XMC form factor
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Dimensions: 149 mm x 74 mm, 10-mm stacking height
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Environmental Requirements
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Supported ruggedization levels (see chart) Level 1, Level 2, Level 3, Level 4, Level 5
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Humidity: 0% to 95% non-condensing
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Power Requirements
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20 W (1.06 GHz)
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