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| Freescale Dual-Core MPC8572E PowerQUICC™ III Processor-Based Conduction- or Air-Cooled VPX-REDI Module
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Features
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Freescale MPC8572E PowerQUICC™ III processor with dual PowerPC e500 cores at up to 1.5 GHz
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3U VPX (VITA 46) module
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Ruggedized Enhanced Design Implementation (REDI)
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Conduction or air cooling
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Two channels of up to DDR2-800 ECC SDRAM, up to 4 GB (2 GB each)
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Up to 256 MB of NOR flash (with redundancy)
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Up to 4 GB of NAND flash
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PrPMC/XMC interface
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x4 PCI Express or Serial RapidIO Fat Pipe P1.A fabric interconnect
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x4 PCI Express P1.B fabric interconnect
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Two SERDES Gigabit Ethernet Thin Pipe P1 fabric interconnects
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Two optional Gigabit Ethernet P2 ports
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Up to two RS-232/RS-422/RS-485 serial P2 ports
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Front I/O available via plugover module
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Linux LSP
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Wind River VxWorks BSP
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QNX Neutrino BSP
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Green Hills INTEGRITY BSP
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Description
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| The XPedite5370 is a high-performance 3U VPX-REDI single-board computer based on the Freescale MPC8572E PowerQUICC III processor. With dual PowerPC e500 cores running at up to 1.5 GHz, the MPC8572E delivers enhanced performance and efficiency for today's embedded computing applications.
The XPedite5370 supports two separate channels of up to 2 GB each of up to DDR2-800 ECC SDRAM, as well as up to 4 GB of NAND flash and up to 256 MB of NOR flash (with redundancy). The XPedite5370 provides the option of utilizing a PCI Express or Serial RapidIO Fat Pipe P1 interconnect, as well as two SERDES Gigabit Ethernet Thin Pipe P1 fabric interconnects. The XPedite5370 also supports dual Gigabit Ethernet, GPIO, I²C, PMC I/O, XMC I/O, and up to two RS-232/RS-422/RS-485 serial ports through the P2 connector.
The XPedite5370 provides a ruggedized, high-performance, feature-rich solution to support the next generation of rugged embedded applications. Wind River VxWorks, QNX Neutrino, and Green Hills INTEGRITY Board Support Packages (BSPs) are available, as well as a Linux LSP.
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Block Diagram
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Processor
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Freescale MPC8572E PowerQUICC III processor
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Dual PowerPC e500 cores at up to 1.5 GHz
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1 MB of shared L2 cache
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Memory
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Two channels of up to DDR2-800 ECC SDRAM, up to 4 GB (2 GB each)
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Up to 256 MB of NOR flash (with redundancy)
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Up to 4 GB of NAND flash
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VPX (VITA 46) P1 I/O
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x4 PCI Express or Serial RapidIO to P1.A
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x4 PCI Express to P1.B
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Two SERDES Gigabit Ethernet ports (or one 10/100/1000BASE-T port out P1 and one 10/100/1000BASE-T port out P2)
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X12d XMC P16 I/O
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VPX (VITA 46) P2 I/O
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One 10/100/1000BASE-T port (when two SERDES Gigabit Ethernet P1 ports are not used)
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Up to two RS-232/RS-422/RS-485 serial ports
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I²C port
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3.3V GPIO signals
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P64s PMC P14 I/O
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PrPMC/XMC Site
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32-bit, 66-MHz PCI bus (PMC interface)
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x4 PCIe port (XMC interface)
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P64s P14 I/O support
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X12d P16 I/O support
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Front Panel I/O
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Front-panel RJ45 Ethernet and mini-DB9 RS-232 serial ports available via optional plugover module
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Software Support
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Linux LSP
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Wind River VxWorks BSP
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QNX Neutrino BSP
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Green Hills INTEGRITY BSP
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Windows drivers
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Physical Characteristics
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3U VPX-REDI conduction- or air-cooled form factor
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Dimensions: 100 mm x 160 mm
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0.8-in. pitch without solder side cover
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0.85 and 1.0-in. pitch with solder side cover
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Environmental Requirements
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Air-cooled operating temperature: -40 to 70 ºC (ambient, with 200-LFM airflow)
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Conduction-cooled operating temperature: -40 to 85 ºC (at thermal interface)
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Humidity: 0% to 95% non-condensing
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Storage temperature: -55 to 105 ºC
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Ruggedization
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Air-cooled: VITA 47 Class V1 vibration, Class OS1 shock
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Conduction-cooled: VITA 47 Class V3 vibration, Class OS2 shock
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Power Requirements
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Maximum power consumption: 35 W (with 1.5-GHz processor), 27 W (with 1.2-GHz processor)
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