3U VPX Conduction-Cooled Development System

November 05, 2009: Extreme Engineering Solutions (X-ES) is the first to ship an OpenVPX™ compliant 3U development system. XPand1200 supports up to ten 1” or 0.8” pitch conduction-cooled VPX (VITA 48.2) modules.

Featuring rapid I/O configuration via RTM modules, star PCIe and Gigabit Ethernet topologies, and including PCIe and Gigabit Ethernet switch. The XPand1200 supports up to 550 W of total simultaneous power delivery and a thermal dissipation of up to 50 W per slot. Weighing 38 lbs (including backplane and power supply) and measuring 8.5” (H) x 11” (W) x 13” (L), the XPand1200 is designed to make the path from conduction-cooled development to deployment effortless.

“Our customers have asked for a rapid software and hardware evaluation system,” states Ben Klam, VP of Engineering. “The XPand series of development systems exceed this requirement by allowing production modules to be used in a cost-effective evaluation and demonstration setting,” Mr. Klam adds.