3U VPX Air-Cooled Development System

3U VPX Air-Cooled Development System

December 4, 2009: Extreme Engineering Solutions (X-ES) is now shipping XPand1300 an OpenVPX™ compliant 3U development system for air-cooled modules. XPand1300 is designed to support up to twelve 1” or up to fifteen 0.8” pitch air-cooled VPX (VITA 48.1) and cPCI (PICMG 2.0) modules.

Featuring rapid I/O configuration via RTM modules, removable side covers for debug access, star PCIe and Gigabit Ethernet topologies, and including PCIe and Gigabit Ethernet switch. Up to 20 CFM of air-flow is provided per slot as well as 550 W of total simultaneous power delivery. The XPand1300 provides the system developer maximum performance and flexibility; weighing only 19 lbs (including backplane and power supply) and measuring 13.5” (H) x 13.5” (W) x 11.6” (L).

 

Expert Comments

“Our customers have asked for a rapid software and hardware evaluation system,” states Ben Klam, VP of Engineering. “The XPand series of development systems exceed this requirement by allowing production modules to be used in a cost-effective evaluation and demonstration setting,” Mr. Klam adds.

Related Products

   
3U VPX Boards
 
3U cPCI Boards