½ ATR Compliant, Conduction-Cooled System

April 20, 2009: Extreme Engineering Solutions (X-ES) introduces XPand3200, a sub-½ ATR, conduction-cooled system solution targeting dual-core Intel and Freescale CPU cards plus optional 32 – 64 GB of removable “shirt pocket” storage. This fully ruggedized system redefines the limits of Size, Weight and Power (SWaP) in today’s avionics and vetronics environments and supports VPX and/or cPCI architectures. Additionally, the XPand3200 can be configured to meet custom I/O requirements with various conduction-cooled PMC / XMC or 3rd party modules.

XPand3200 can be populated with high-performance, low-power 3U VPX or cPCI X-ES single-board computers. It supports Gigabit Ethernet, graphics, RS-232/RS-422/RS-485, MIL-STD-1553, MIL-STD-188-114A, ARINC 429, discrete I/O, as well as custom conduction-cooled PMC/XMC I/O through the back-panel D38999 circular connectors. A front-panel USB port and removable SATA solid-state memory module are also available.

The XPand3200 has been designed with the flexibility to accommodate unique I/O requirements with standards based products. Please contact Electronic Tools to discuss a solution that will meet and exceed your processing, I/O and power requirements.

“Customers have told us ‘XPand3200 is the highest performance ½ ATR system available today’,” states Bret Farnum, VP of Sales. “Adding power supply capable of supporting up to 110ms of hold-up time, plus an array of CPU, FPGA, and I/O options, makes XPand3200 an easy ‘design-in’ for new programs requiring a MIL-STD-810 system solution.”